Original and unpublished papers on all aspects on VLSI technology and manufacturing are solicited.<br>SCOPE OF PAPER SOLICITED<br>CMOS, SiGe bipolar, and BiCMOS IC technologies<br>DRAM, SRAM and advanced non–volatile memory technologies<br>Merged logic and memory<br>SOI material and devices<br>Device and interconnect reliability<br>Process and device modeling<br>Advanced lithography technology and unconventional lithography.<br>TFT technology<br>Advanced packaging technology<br>RF devices and technologies<br>Advanced process technology<br>Advanced Interconnect technology<br>3D Integration technology<br>Advanced gate stack science and technology.<br>Nanoelectronic devices/technology<br>Organic electronics and photonics<br>Steep Subthreshold devices and other energy efficiency related devices<br>Novel device concepts<br>Yield enhancement<br>Process control<br>MEMS and other Microsystems<br>Integration of non–traditional functions on silicon IC platform<br>
Abbrevation
VLSI-TSA
City
Hsinchu
Country
Taiwan
Deadline Paper
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