The International Symposium on Physical Design provides a premier forum to exchange ideas and promote<br>research on critical areas related to the physical design of VLSI systems. All aspects of physical design, including<br>its interactions with architecture, behavioral– and logic–level synthesis, and back–end performance analysis and<br>verification are within the scope of the symposium. Target domains include semi–custom and full–custom IC′s,<br>regular fabrics, FPGA′s, and systems–on–chip/systems–in–package. Following its twenty–one predecessors, the 2013<br>symposium will highlight key new directions and leading–edge theoretical and experimental contributions to the<br>field. The ACM Press will publish accepted papers in the Symposium proceedings. Topics of interest include but<br>are not limited to:<br>– Floorplanning and interconnect planning 。Interactions with behavior–level synthesis flows<br>– Partitioning, placement and routing 。Interactions with logic–level (re–)synthesis flows<br>– Physical design for manufacturability and yield 。Analysis and management of power dissipation<br>– Synthesis optimizations within physical design 。Management of design data and constraints<br>– Estimation and modeling 。New physical design methodologies<br>– Timing and crosstalk issues in physical design 。New paradigms in physical design<br>– Special structures for clocking and power networks 。Circuit performance measurements in a PD context<br>– Physical design for emerging process technologies 。Multithreaded/distributed algorithms for physical design<br>– Makeover of traditional PD problem formulation for 。Critiques and in–depth analysis of previously published<br>technology nodes and new applications PD algorithms with new experimental results for better<br>comparison<br>
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ISPD
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Lake Tahoe Vicinity
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United States
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