Abbrevation
APCM
City
Dresden
Country
Germany
Deadline Paper
Start Date
End Date
Abstract

<p style="text&#8211;align:center" align="center"><strong><span style="color:navy">The European APC|M Conference will be built</span></strong><b><span style="color:navy"><br><strong><span style=&#8243;>around sessions of following topics:</span></strong></span></b></p> <p><strong><u><span style="font&#8211;size:10&#046;0pt;color:navy">Advanced Process Control on Unit Process Level</span></u></strong><span style="font&#8211;size:10&#046;0pt;color:navy"></span></p> <ul><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">APC applications at Unit Processes</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br><em><span style=&#8243;>Plasma processes</span></em></span></b><span style="font&#8211;size:10&#046;0pt;"> (PVD, PECVD, plasma etch, P3I), <em><b><span style=&#8243;>Thermal processes</span></b></em> (CVD, e&#8211;beam, i&#8211;beam, evaporation, doping, epitaxy, diffusion, RTP), <em><b><span style=&#8243;>Wet processes</span></b></em> (clean, etch, electro&#8211; and electroless plating), <em><b><span style=&#8243;>Metrology</span></b></em> (films, defect density, in line and large area metrology), <em><b><span style=&#8243;>Lithography </span></b></em>(track, exposure tool), <em><b><span style=&#8243;>Implant, CMP, Backend</span></b></em></span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Unit process control methods</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Fault detection and classification (FDC) and fault prediction (FP), Run&#8211;to&#8211;Run Control (R2R), large area uniformity, unit process development and transfer</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Tool and sensor data analysis</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Sensor implementation and integration, data collection, aggregation, classification and quality, assigning of logistical data, statistical approaches and non&#8211;statistical measures</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Maintenance &amp; tool optimization</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Preventive maintenance, condition&#8211;based maintenance, predictive maintenance, tool improvements, spare parts assessment and qualification, conditioning and first wafer effects, chamber matching</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Enhanced Equipment Quality Assurance (EEQA)</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Physical and chemical unit process models and model&#8211;based sensors, methods to ensure component functionality, reliability, performance and traceability, Equipment Health Monitoring (EHM)</span> </li></ul> <p><strong><u><span style="font&#8211;size:10&#046;0pt;color:navy">Advanced Process Control on Fab Level</span></u></strong><span style="font&#8211;size:10&#046;0pt;color:navy"></span></p> <ul><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Fab level process control methods</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Run&#8211;to&#8211;Run and Wafer&#8211;to&#8211;Wafer control, realtime control, control algorithms, defect inspection, test structures (wafer), sampling strategy</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Virtual metrology</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Application of process models, control density improvement, reduction of measurement operations and non&#8211;product wafers, throughput increase</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Yield management</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Prediction and improvement of product parameters and yield by use of APC methods, novel methods of yield modeling and management</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Factory data analysis</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Real&#8211;time data collection aggregation, classification and quality, process and equipment capability, mathematical methods and model creation, novel methods of data visualization and data analysis</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">IT infrastructure</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Tool interfaces and communication, sensor / actuator bus, interfaces, demands on new standards</span> </li></ul> <p><strong><u><span style="font&#8211;size:10&#046;0pt;color:navy">Manufacturing Effectiveness and Productivity</span></u></strong><span style="font&#8211;size:10&#046;0pt;color:navy"></span></p> <ul><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Unit process &amp; equipment productivity</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Throughput and uptime improvement, cycle time and variability reduction, non&#8211;productive wafer and substrate reduction, tool and unit process related productivity improvement</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Factory productivity and automation</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Factory scheduling and dispatching optimization, throughput and uptime improvement, cycle time and variability reduction, automation&#8211;related productivity improvement, master data management, Material tracking of materials, spare parts and consumables, production control</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Factory modeling, simulation and optimization</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Design for manufacturing, future factory design, capacity and cost modeling, yield modeling &amp; improvement, novel methods of manufacturing data analysis and visualization</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Cost optimisation and end&#8211;of&#8211;life equipment issues</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Fixed and variable cost reduction, Cost of Ownership (CoO) and Overall Equipment Efficiency (OEE), unit cost modelling, equipment and maintenance optimization</span> </li><li class="MsoNormal" style="color:navy;"> <strong><span style="font&#8211;size:10&#046;0pt;">Environment and Green Manufacturing</span></strong><b><span style="font&#8211;size:10&#046;0pt;"><br></span></b><span style="font&#8211;size:10&#046;0pt;">Global ESH strategies, facilities operations, facility systems reliability improvements, manufacturing sustainability and resource conservation, lean manufacturing</span></li></ul>