IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI, Natal, Brasilien

Abbrevation

ISVLSI

Link

http://www.lasic.ufrn.br/isvlsi2013/index.php?id=visa_request

City

Natal

Country

Brazil

Deadline Paper

2013-02-22

Start Date

2013-08-05

End Date

2013-08-07

Abstract

This Symposium explores emerging trends and novel ideas and concepts in the area of VLSI. The Symposium covers a range of topics: from VLSI circuits, systems and design methods to system level design and system–on–chip issues, to bringing VLSI experience to new areas and technologies like nano– and molecular devices, MEMS, and quantum computing. Future design methodologies will also be one of the key topics at the workshop, as well as new CAD tools to support them. Over almost two decades the symposium has been an unique forum promoting multidisciplinary research and new visionary approaches in the area of VLSI. The Symposium is bringing together leading scientists and researchers from academia and industry. The papers from this symposium have been published as the special issues of top archival journals. This fact indicates a very high quality of the symposium papers, and we are determined to keep a strong emphasis on this critical aspect of any conference. The symposium proceedings are published by IEEE Computer Society Press. A set of best papers will be invited to submit extended versions to be published in a book by Springer. Several leading scientist from newly emerging areas will be invited speakers at the symposium. The Symposium has established a reputation in bringing well–known international scientists as invited speakers, and this trend will continue. Emerging Trends in VLSI, Nanoelectronics, Molecular, Biological and Quantum Computing. MEMS, VLSI Circuits and Systems, Field–programmable and Reconfigurable Systems, System Level Design, System–on–a–Chip Design, Application–Specific Low Power, VLSI System Design, System Issues in Complexity, Low Power, Heat Dissipation, Power Awareness in VLSI Design, Test and Verification, Mixed–Signal Design and Analysis, Electrical/Packaging Co–Design, Physical Design, Intellectual property creating and sharing.