The 15th Electronics Packaging Technology Conference (EPTC 2013) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society. EPTC 2013 will feature technical sessions, short courses/forums, an exhibition, social and networking activities. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field. Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in Asia and is well attended by experts in all aspects related to packaging technology from all over the world.<br>CONFERENCE TOPICS You are invited to submit an abstract, presenting new development in the following categories:<br>Advanced Packaging: Flip–chip and wire–bond packaging, embedded passives and actives on substrates, 3D System in Packaging, etc.<br>TSV/Wafer Level Packaging: Wafer level packaging, embedded chip packaging, 3D integration, TSV, Silicon interposer, RDL, bumping technologies, etc.<br>Interconnection Technologies: Wire–bond technology, Flip–chip technology, solder alternatives (ICP, ACP, ACF, NCP), die attachment (Pb–free), etc.<br>Emerging Technologies: Packaging technologies for MEMS, biomedical, optoelectronics, photo voltaic, printed electronics, wearable electronics, etc.<br>Materials & Processes: Materials and processes for traditional and advanced microelectronic systems, MEMS, solar, green and biomedical packaging.<br>Electrical Modeling & Simulations: Power plane modeling, signal integrity analysis of substrate/package.<br>Mechanical Modeling & Simulations: Thermo–mechanical, moisture, fracture, fatigue, vibration, and drop impact modeling, Chip–package interaction, etc.<br>Thermal Characterization & Cooling Solutions: Thermal modeling and simulation, component and system level thermal management and characterization<br>Quality & Reliability: Component, board and system level reliability assessment, Interfacial adhesion, accelerated testing, failure characterization, etc.<br>Wafer/Package Testing & Characterization: High–speed test architectures and systems design, test methodologies, probe card design, package–test interaction, high–throughput testing etc.<br>
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EPTC
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Singapore
Country
Singapore
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