IEEE 8th International Symposium on Embedded Multicore/Many-core SoCs, Aizu-Wakamatsu, Japan

Abbrevation

MCSoC

Link

http://www.mcsoc-forum.org/

City

Aizu-Wakamatsu

Country

Japan

Deadline Paper

2014-03-31

Start Date

2014-09-24

End Date

2014-09-26

Abstract

The International Symposium on Embedded Multicore/Many–core System–on–Chip (MCSoC–14) aims at providing the world′s premier forum of leading researchers in the embedded Multicore/Many–core SoCs software, tools and applications design areas for Academia and industries. Prospective authors are invited to submit paper of their works. Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon acceptance of the paper. Topics of Interests: Software for Embedded Multicore and Many–core: Compilers, cross assemblers, programming, memory management, object–oriented aspects, virtual machines, concurrent software for SoCs. Hardware for Embedded Multicore and Many–core: SoCs, DSPs, hardware specification, modeling, synthesis, low power simulation and analysis, reliable, performance modeling, security issues. Embedded Multicore System Architecture: Multicore, Many–core, reconfigurable platforms, memory management support, communication, protocols, real–time systems. Electronic Network–on–Chip: NoC architecture, Power and energy issues in NoC , Application specific NoC design, Timing, synchronous /asynchronous communication, RTOS support for NoC, Modeling, simulation, NoC support for MCSoC, NoCs for FPGAs and structured ASICs, NoC design tools. Silicon Photonic NoCs: Design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design, Topics related to Large–scale systems (datacenters, supercomputers) with Optical NoC–based systems. Multicore/Many–core Testing: Design–for–test, test synthesis, built–in self–test, embedded test for MCSoC Multicore Practices & Benchmarks: Software, tools, trends, emerging technologies, experience maintaining benchmark suites, representation, tools, copyrights, maintenance. Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal Management. Embedded Real–Time Systems: real–time system design, OS, Compilation techniques, memory/cache optimization, interfacing and software issues, Software, distributed real–time systems, real–time kernels, task scheduling, multitasking design.