Abbrevation
ICICTES
City
Ayutthaya
Country
Thailand
Deadline Paper
Start Date
End Date
Abstract

The fifth International Conference of Information and Communication Technology for Em<br>bedded Systems (IC&#8211;ICTES 2014) is established to provide an international forum for researchers and industry practitioners to share their new ideas, original research results and practical development experiences from all embedded system&#8211;related areas including ubiquitous computing, pervasive computing, embedded system design, development of new HW/SW&#8211;related theories and techniques in embedded systems , information and<br>communication technology for supporting development of embedded systems, and information and communication technology used in embedded systems&#046;<br>AREAS OF INTEREST<br>The conference calls for research papers reporting original investigation results of research and development on real embedded system applications and their system development&#046; Topics in IC&#8211;ICTES 2014 are listed below, but not limited to:<br>A&#046; Embedded system architecture: Multiprocessors, reconfigurable platforms, memory management support, communication, protocols, network&#8211;on&#8211;chip, real&#8211;time systems, embedded microcontrollers&#046;<br>B&#046; Real&#8211;time systems: All real&#8211;time related aspects such as software, distributed real&#8211;time systems, real&#8211;time kernels, real&#8211;time OS, task scheduling, multitasking design&#046;<br>C&#046; Embedded hardware support: System&#8211;on&#8211;a&#8211;chip, DSPs, hardware specification, synthesis, modeling, simulation and analysis at all levels for low power, power&#8211;aware, testable, reliable, veriable systems, performance modeling, validation, security issues, real&#8211;time behavior and safety critical systems&#046;<br>D&#046; Embedded software: Compilers, assemblers and cross assemblers, programming, memory management, object&#8211;oriented aspects, virtual machines, scheduling, concurrent software for SoCs, distribut ed/resource aware OS, OS and middleware support&#046;<br>E&#046; Hardware/software co&#8211;design: Methodologies, test and debug strategies,real&#8211;time systems, specification and modeling,design representation, synthesis, partitioning, estimation, design space exploration beyond traditional hardware/software boundary and algorithms&#046;<br>F&#046; Testing techniques: All aspects of testing, including design&#8211;for&#8211;test, test synthesis, built&#8211;in self&#8211;test, embedded test, for embedded and systern&#8211;on&#8211;a&#8211;chip systems&#046;<br>G&#046; Application&#8211;specific processors and devices: Network processors, real&#8211;time processor, media and signal processors, application specific hardware accelerators, econfigurable processors, low power embedded processors, bio/fluidic processors, Bluetooth, hand&#8211;held devices, flash memory chips&#046;<br>H&#046; Industrial practices and benchmark suites: System design, processor design, software, tools, case studies, trends, emerging technologies, experience maintaining benchmark suites, representation, interchange format, tools, copyrights, maintenance, metrics&#046;<br>I&#046; Embedded computing education: Curriculum issues, teaching tools and methods&#046;<br>J&#046; Emerging new topics: New challenges for next generation embedded computing systems, arising from new technologies (e&#046;g&#046;, nanotechnology), new applications (e&#046;g&#046;, pervasive or ubiquitous computing, embedded internet tools) and new principle (e&#046;g&#046;, embedded Engineering)&#046;<br>K&#046; Embedded System Applications: All ranges of applications on embedded system, including speech processing, image processing, network computing, distributed computing, parallel computing and power conversion&#046;<br>L&#046; Automotive Engineering: Automotive design, new challenges on development of autoparts and automatives, safety engineering, fuel economy/emissions,vehicle dynamics, NVH engineering, automotive performance, shift quality, durability/corrosion engineering, package/ergonomics engineering, climate control, derivability, program timing,<br>assembly feasibility,automotive embedded systems&#046;<br>