IEEE 8th International Symposium on Embedded Multicore/Many-core Systems-on-Chip, Aizu-Wakamatsu, Japan

Abbrevation

MCSoC

Link

http://mcsoc-forum.org/2014/

City

Aizu-Wakamatsu

Country

Japan

Deadline Paper

2014-03-31

Start Date

2014-09-23

End Date

2014-09-25

Abstract

The IEEE 8th International Symposium on Embedded Multicore/Many–core Systems–on–Chip aims at providing the worldâ€™s premier forum of leading researchers in the embedded Multicore/Many–core SoCs software, tools and applications design areas for Academia and industries. Prospective authors are invited to submit paper of their works. Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon acceptance of the paper. – Embedded Multicore/Many–core Programming: Compilers, cross assemblers, Programming models, memory management, object–oriented aspects, concurrent software. – Embedded Multicore/Many–core Architectures: Multicore, Many–core, re–configurable platforms, memory management support, communication, protocols, real–time systems, SoCs and DSPs. – Embedded Multicore/Many–core Design : Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, performance modeling, security issues. – Embedded Multicore/Many–core Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design. – Embedded Multicore/Many–core Testing: Design–for–test, Test synthesis, Built–in–self–test, Embedded test for MCSoC. – Embedded Multicore/Many–core Packaging Technologies: 3D VLSI packaging Technology, vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes. – Embedded Multicore/Many–core Real–Time Systems: real–time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real–time systems, real–time kernels, Task scheduling, Multitasking design. – Embedded Multicore/Many–core Benchmarks: Parallel Benchmarks, Workload characterization and evaluation. – Embedded Multicore/Many–core Applications: Bio–medical, Aviation, Automobile, Military, Consumer electronics, and Novel applications.