IEEE International Interconnect Technology Conference/ Advanced Metallization Conference, San Jose, Vereinigte Staaten

In 2014, the International Interconnect Technology Conference (IITC) will be held in conjunction with the Advanced Metallization Conference (AMC) in San Jose, California&#046; The 16th annual IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology&#046; The joint conference will mark the 31st AMC in an annual series of meetings devoted to leading&#8211;edge research in the field of advanced metallization and 3D integration for ULSI IC applications&#046;<br>IITC/AMC has announced a Call for Papers for work describing innovative developments in the critically important field of interconnections for electronic systems&#046; The conference seeks papers on all aspects of interconnects for device, circuit board and system&#8211;level applications&#046; The deadline for submission of abstracts is February 1, 2014&#046;<br>IITC/AMC 2014 will be held May 21–23 at the DoubleTree Hotel in San Jose, California&#046; It will be preceded by a day&#8211;long workshop on “Manufacturing of Interconnect Technologies: Where are we now and where do we go from here?” on Tuesday, May 20&#046;<br>The conference attracts professionals from industry, academia, and national laboratories in semiconductor processing, interconnect design, and equipment development&#046;<br>The conference topics include both fundamental and applied research, as well as issues related to introduction into manufacturing&#046; Subjects of interest include all aspects of Interconnects:<br>Materials and Unit Processes<br>Process Integration<br>Characterization<br>Reliability<br>Chip&#8211;Package Interaction (CPI)<br>3D Integration and TSV Technology<br>Contacts and FEOL metallization<br>Memory elements in the interconnect<br>Novel Systems and Packaging including optical interconnects, RF, and SoC<br>Novel Materials and Concepts<br>MEMS<br>