Abbrevation
ISQED
City
Hangzhou
Country
China
Deadline Paper
Start Date
End Date
Abstract

ISQED strives to bridge the gap among electronic design tools and processes, integrated circuit technologies, processes &amp; manufacturing, to achieve design and intends to highlight and accelerate cooperation among the IC design, EDA, Semiconductor Process Technology, IC Packaging, Test, and Manufacturing communities&#046; ISQED&#8211;China’14 starts with Microelectronic Olympiad competition on Monday Oct&#046; 27 and then spans two days, in four parallel tracks, hosting many technical presentations, several keynote speakers, tutorials and other informal meetings&#046; All past conference proceedings have been published by IEEE and posted in the IEEE digital library and indexed by Scopus&#046;<br>Papers are requested in the following areas<br>As a premier Asia Symposium, ISQED accepts and promotes papers related to circuit and system design (digital, analog, RF, and mixed&#8211;signal), semiconductor manufacturing, advanced IC Packaging, Test, Electronic Design Automation (EDA), as well as emerging semiconductor nano/bio&#8211;technologies, and photovoltaic electronics&#046; Topics of interest for paper submission are as follows:<br>IC and System&#8211;level Design &amp; Test System&#8211;level Design, Methodologies &amp; Tools<br>&#8211; Analog, Digital, Mixed&#8211;Signal and RFIC Design<br>&#8211; FPGA Architecture, Design, and CAD<br>&#8211; Robust &amp; Power&#8211;conscious Circuits &amp; Systems<br>&#8211; Design of Reliable &amp; Fault Tolerant Circuits and Systems<br>&#8211; Design of Embedded Systems<br>IP Design, Quality, Interoperability and Reuse<br>&#8211; Design Verification and Design for Testability<br>&#8211; Physical Design, Methodologies &amp; Tools<br>&#8211; EDA Methodologies, Tools, Flows<br>Semiconductor Materials, Process and Devices Emerging/Innovative<br>&#8211; Process &amp; Device Technologies<br>&#8211; Yield and Reliability Analysis, Prediction, and Management<br>Advanced IC Packaging, 3D ICs IC Package &#8211; Design Interactions &amp; Co&#8211;Design<br>&#8211; Advanced 3D ICs &amp; 3D Packaging<br>&#8211; High density PCB/PWB<br>&#8211; Signal and Power Integrity<br>Sensors Technology, Design and Applications, MEMS/NEMS<br>Mobile Internet and Internet of Things: Technology, Design and Applications<br>Antennas Technology, Design and Applications, Wireless Power Transfer<br>