International Conference On Computer-Aided Desgin, San Jose, Vereinigte Staaten

Abbrevation

ICCAD

Link

http://iccad.com

City

San Jose

Country

United States

Deadline Paper

2014-04-14

Start Date

2014-11-03

End Date

2014-11-06

Abstract

ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions for Integrated Circuit Design Technologies and Systems. ICCAD covers the full range of CAD topics Ã¢â‚¬â€œ from device and circuit–level CAD up through system–level CAD and embedded software, as well as CAD for post–CMOS design and novel application areas, such as biology and nanotechnology.1) SYSTEM–LEVEL CAD 1.1 System Design: <ul><li>System–level specification, modeling, and simulation</li><li>System design flows and methods</li><li>HW/SW co–design, co–simulation,co–optimization, and co–exploration</li><li>HW/SW platforms</li><li>Rapid prototyping</li><li>System design case studies and applications</li><li>System–level issues for 3D integration</li><li>Micro–architectural transformation</li><li>Memory architecture and system synthesis</li><li>System communication architecture</li><li>Network–on–chip design methodologies and CAD</li><li>Network–on–chip design case studies and prototyping</li></ul>1.2 Embedded Systems Hardware: <ul><li>Multi–core/multi–processors systems</li><li>Heterogeneous embedded architectures</li><li>HW/SW co–design for embedded systems</li><li>Static and dynamic reconfigurable architectures</li><li>Memory hierarchies and management</li><li>Custom storage architectures (flash, phase change memory, STT–RAM, etc.)</li><li>Application–specific instruction–set processors (ASIPs)</li></ul>1.3 Embedded Systems Software: <ul><li>Real–time software and operating systems</li><li>Middleware and virtual machines</li><li>Timing analysis and WCET</li><li>Programming models for multi–core systems</li><li>Profiling and compilation techniques</li><li>Design exploration, synthesis, validation, verification, and optimization</li><li>HW/SW security techniques</li></ul>1.4 Power and Thermal Considerations in System Design: <ul><li>Power and thermal estimation, analysis, optimization, and management techniques for hardware and software systems</li><li>Energy– and thermal aware application mapping and scheduling</li><li>Energy– and thermal–aware dark silicon system design and optimization</li></ul>2) SYNTHESIS, VERIFICATION, AND PHYSICAL DESIGN 2.1 High–Level, Behavioral, and Logic Synthesis and Optimization: <ul><li>High–level/Behavioral/Logic synthesis</li><li>Technology–independent optimization and technology mapping</li><li>Functional and logic timing ECO</li><li>Resource scheduling, allocation, and synthesis </li><li>Interaction between logic synthesis and physical design</li></ul>2.2 Validation, Simulation, and Verification: <ul><li>High–level/Behavioral/Logic modeling and validation</li><li>High–level/Behavioral/Logic simulation</li><li>Formal, semi–formal, and assertion–based verification</li><li>Equivalence and property checking</li><li>Emulation and hardware simulation/acceleration</li><li>Post–silicon functional validation</li></ul>2.3 Cell–Library Design, Partitioning, Floorplanning, Placement: <ul><li>Cell–library design and optimization</li><li>Transistor and gate sizing</li><li>High–level physical design and synthesis</li><li>Estimation and hierarchy management</li><li>2D and 3D partitioning, floorplanning, and placement</li><li>Post–placement optimization</li><li>Buffer insertion and interconnect planning</li></ul> 3) CAD FOR MANUFACTURABILITY, RELIABILITY, AND TEST 3.1 Design for Manufacturability: <ul><li>Process technology characterization, extraction, and modeling</li><li>CAD for design/manufacturing interfaces</li><li>CAD for reticle enhancement and lithography–related design</li><li>Variability analysis and statistical design and optimization</li><li>Yield estimation and design for yield</li></ul>3.2 Design for Reliability: <ul><li>Analysis and optimization for device–level reliability issues (stress, aging effects, ESD, etc.)</li><li>Analysis for interconnect reliability issues (electromigration, thermal, etc)</li><li>Reliability issues related to soft errors</li><li>Design for resilience and robustness</li></ul>3.3 Testing: <ul><li>Digital fault modeling and simulation</li><li>Delay, current–based, low–power test</li><li>ATPG, BIST, DFT, and compression</li><li>Memory test and repair</li><li>Core, board, system, and 3D IC test</li><li>Post–silicon validation and debug</li><li>Analog, mixed–signal, and RF test</li></ul>4) CAD FOR CIRCUITS, DEVICES, AND INTERCONNECT 4.1 Timing, Power, and Power Networks: <ul><li>Deterministic and statistical static timing analysis and optimization</li><li>Power and leakage analysis and optimization</li><li>Circuit and interconnect–level low power design issues</li><li>Power/ground network analysis and synthesis</li></ul>4.2 Signal Integrity and Devices/Interconnect Modeling and Simulation: <ul><li>Signal integrity analysis and optimization</li><li>Package modeling, analysis, and optimization</li><li>EMI/EMC simulation and optimization</li><li>Device, interconnect, and circuit modeling, extraction, and simulation</li><li>Behavioral modeling of devices and circuits</li></ul>4.3 CAD for RF/analog and Multi–Domain Modeling and Analysis: <ul><li>CAD for analog, mixed–signal, RF</li><li>CAD for mixed–domain (semiconductor, nanoelectronic, MEMS, and electro–optical) devices, circuits, and systems</li><li>CAD for nanophotonics</li><li>Modeling and Analysis for complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)</li></ul>5) CAD FOR EMERGING TECHNOLOGIES AND APPLICATIONS 5.1 Biological Systems and Bio–Electronics: <ul><li>CAD for biological computing systems</li><li>CAD for system and synthetic biology</li><li>CAD for bio–electronic devices, bio–sensors, MEMS, and systems</li></ul>5.2 Nanoscale and Post–CMOS Systems: <ul><li>New device structures and process technologies</li><li>New memory technologies (flash, phase change memory, STT–RAM, memristor, etc.)</li><li>Nanotechnologies, nanowires, nanotubes, graphene, etc.</li><li>Quantum computing</li><li>Optical devices and communication</li><li>CAD for bio–inspired and neuromorphic systems</li></ul>5.3 CAD for Cyberphysical Systems: <ul><li>CAD for display electronics</li><li>CAD for automotive systems and mobile electronics</li><li>CAD for sensor networks and Internet–of–things</li><li>Analysis and optimization of data centers </li><li>Green computing (smart grid, energy, solar panels, etc.) </li></ul>