Abbrevation
SDCS
City
Istanbul
Country
Turkey
Deadline Paper
Start Date
End Date
Abstract

The workshop to be held in Istanbul&#8211;TURKEY, on August 22&#8211;23, 2014&#046;<br>The purpose of the workshop is to provide a public forum for researchers<br>from academia, defence, government and industry to present, exchange ideas and<br>discuss developments in Semiconductor Devices, Circuits and Systems<br>Topics include, but are not limited to, the following:<br>3D Integration technology<br>3D&#8211;IC designs<br>Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc&#046;)<br>Advanced gate stack science and technology<br>Advanced Interconnect technology<br>Advanced lithography technology and unconventional lithography<br>Advanced packaging technology<br>Advanced process technology<br>Analog &amp; RF &amp; Mixed Signal<br>Bio Electronics Innovations<br>Bio sensors, Imagers, thermoelectric, energy harvesting<br>Bioinspired Systems<br>Biomedical Circuits and Systems<br>Built&#8211;In Self Test and Calibration<br>Circuit &amp; System Design<br>Circuits and Systems for Communications<br>Compound semiconductor devices and circuits<br>Conventional and Novel device concepts in CMOS, SiGe bipolar, and BiCMOS IC echnologies<br>Defect and Fault Tolerance Techniques<br>Design verification and simulation<br>Design, specification and modeling languages and applications<br>Device and interconnect reliability<br>Digital, Analog, Mixed Signal IC and SOC design technology<br>Displays, sensors and MEMS<br>DRAM, SRAM and advanced non&#8211;volatile memory technologies<br>Electronic Design Automation methodologies<br>Embedded Design &amp; SoC<br>Embedded Memory<br>Embedded systems design and industrial applications<br>Emulation and prototyping techniques<br>Hardware&#8211;software co&#8211;design and co&#8211;verification<br>Harvesting / Scavenging Energy circuits<br>HP/HV IC designs<br>HW&#8211;SW Codesign<br>IC Packaging Technology<br>Integrated Circuit and system design<br>Integrated sensors &amp; actuators<br>Integration of non&#8211;traditional functions on silicon IC platform<br>Interconnect, Low K, High K and other process technologies<br>Interconnection and packaging technologies<br>Low&#8211;power, RF devices &amp; circuits<br>Micro&#8211;Electro&#8211;Mechanical system (MEMS)<br>MEMS and mensors<br>Merged logic and memory<br>Modeling and simulation<br>More Moore and Beyond Moore devices technologies and architectures<br>Nanoelectronic circuits and nanoarchitectures<br>Nano&#8211;electronics/fabrication/structures<br>New memory technologies, RRAMs, CBRAMs, MRAMs, 1T DRAM<br>Nonlinear Circuits and systems<br>Optical Devices and photonics<br>Organic and flexible electronics<br>Organic semiconductor devices and technologies<br>Packaging and testing technology<br>PCB and PWB Technology &amp; Manufacturing<br>Power and Energy Circuits and systems<br>Programmable devices<br>Reconfigurable architectures and novel applications of FPGAs<br>RF devices and technologies<br>Semiconductor &amp; Nano Technology<br>Semiconductor materials and material characterization<br>Silicon integrated circuits and manufacturing<br>Spintronics based devices<br>System&#8211;on&#8211;Chip (SOC)<br>Testing technology<br>VLSI Systems &amp; Applications<br>