Symposium scope includes new concepts and breakthroughs in VLSI technology devices and processes including:<br>1. Memory, Logic, RF, Analog, Mixed–Signal, I/O, High–Voltage, Imaging, MEMS, integrated sensors, and SOC (system–on–chip)<br>2. Advanced gate stacks, channels, junctions and contacts<br>3. Heterogeneous integration of non–Si materials/substrates on Si substrates<br>4. Advanced lithography and high–density VLSI patterning technologies<br>5. Beyond–CMOS functional devices with a path for VLSI implementation<br>6. Interconnect scaling and Cu alternatives; chip–to–chip including optical interconnects<br>7. Packaging technologies, through–silicon–vias (TSVs) and 3D–system integration<br>8. Advanced materials, device analysis, and modeling<br>9. Theoretical understanding, operation fundamentals and reliability issues related to the above devices<br>10. VLSI manufacturing concepts, technologies and yield optimization<br>The scope of the Symposium on VLSI Circuits includes innovations and advances in the following areas:<br>– Digital circuits and processor techniques, including those for standalone and embedded processors<br>– Memory circuits, architectures, and interfaces for volatile and non–volatile memories, including emerging memories<br>– Clock generation and distribution for high–frequency digital and mixed–signal applications<br>– Analog and mixed–signal circuits, including amplifiers, filters, and data converters<br>– Wireline receivers and transmitters, including circuits for inter–chip and long–reach applications<br>– Wireless receivers and transmitters, including circuits for WAN, LAN, PAN, BAN, and inter–chip applications<br>– Power management circuits, including those for battery management, voltage regulation, and energy harvesting<br>– Application–oriented VLSI systems, imagers, displays, sensors, and biomedical and healthcare applications<br>
Abbrevation
VLSI Circuits
City
Kyoto
Country
Japan
Deadline Paper
Start Date
End Date
Abstract