Over the past eighteen years, the IEEE Workshop on Signal and Power<br>Integrity has evolved into a forum of exchange on the latest research and<br>developments on innovative schemes for signal and power integrity, and in<br>the field of interconnect modeling, simulation and measurement at chip,<br>board and package levels. The workshop is also meant to bring together<br>developers and researchers from industry and academia in order to<br>encourage cooperation.<br>In view of last year‘s success, the Committee is looking forward to the 19<br>th Edition which will convene in Berlin, Germany. The symposium will include<br>both oral and poster sessions. A number of prominent experts will be giving<br>tutorials on areas of emerging interest.<br>Topics of Interest<br>Innovative schemes for SI and PI<br>Noise reduction techniques<br>High–speed link design and modeling<br>Power distribution networks<br>Electronic packages and microsystems<br>3D technologies for IC and packages<br>RF, microwave, mixed signal packaging<br>Nano–interconnects and nano–structures<br>Electromagnetic theory and modeling<br>Transmission line theory and modeling<br>Macro–modeling, reduced order models<br>Simulation tools for SI and PI<br>Electromagnetic Compatibility<br>Design methodology/flow<br>Measurements<br>Jitter and noise modeling<br>Chip–package co–design<br>Novel CAD concepts<br>
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SPI
City
Berlin
Country
Germany
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