<p>Now in its 11th year, 3D Architectures for Semiconductor Integration and Packing (3D ASIP) is firmly established as the leading industry event in 3D integration and packaging. This conference presents a broad, yet thorough perspective on the techno–market opportunities and challenges offered by building devices and systems in the vertical dimension, and provides participants the unique opportunity to gain the latest technology and market insights on 3D integration and packaging efforts, and technology and industry trends impacting this dynamic arena.</p> <p>3D ASIP targets senior–level technologists, managers, and executives as speakers and attendees from leading companies and organizations from around the world, and strives to serve the needs of the entire 3D supply chain, from technology developers to equipment and materials suppliers to designers, manufacturers, and end users. All speakers are invited. </p> <p>The format of the conference and its presentations enable speakers to present the most up–to–date and forthright perspectives possible, and gives exceptional opportunities to network with and learn from other senior–level technology and business leaders.<br></p><p><br></p>
Abbrevation
3DASIP
City
Burlingame
Country
United States
Start Date
End Date
Abstract