1st International Conference on Functional Integrated nano Systems, Graz, Österreich

Abbrevation

nanoFIS

Link

http://www.nanofis.net/

City

Graz

Country

Austria

Start Date

2014-12-03

End Date

2014-12-05

Abstract

Sophisticated sensors and devices based on Key Enabling Technologies ranging from nanotechnology, micro– and nanoelectronics to photonics, are presently being developed in many R&D labs worldwide for future high–performance products. 3D heterogeneous integration with CMOS–technology is the key for product implementation of those devices and for realizing complex integrated systems with significantly advanced functionalities. This integrated system approach is an essential element of the More–than–Moore Grand Challenge and is expected to create future business opportunities for European semiconductor industries. PANEL DISCUSSION: Airbus of Chips â€“ Feasible European Reality or Science Fiction?â€œ TOPICS: ADVANCED FUNCTIONAL MATERIALS including materials such as Nanowires, Nanorods, Nanodots & Nanoparticles Graphene and Carbon Nanotubes Electroceramic Materials Organic and flexible Electronic Materials Photonic Materials NANOSENSORS including sensor devices such as Nanowire and Nanoparticle based Sensors Chemical Sensors and Particle Sensors Graphene & Carbon Nanotube based Devices Nanophotonic Devices MEMS & NEMS Devices SYSTEM INTEGRATION & PACKAGING including technologies such as 3D Heterogeneous Integration TSV Technologies and TVS based Devices Advanced Wafer Bonding Technologies (W2W, D2W,â€¦) 3D SoC and SiP Solutions RELIABILITY including methods such as Analytical Methods for Failure Mode Detection Material Properties Characterization in nm– and Âµm–scale Advanced Material Modelling and Simulation Crack Propagation and Thermomechanics Statistical Models for short, mid and long term Reliability Prediction INNOVATIVE MANUFACTURING PROCESSES including process technologies such as Novel Manufacturing Techniques for Nanomaterials New Patterning Approaches (NIL, roll–to–rollâ€¦) Thin Film Deposition (ALD, ink–jet,â€¦) Back–end Equipment for 3D packaging