21st Asia and South Pacific Design Automation Conference, Macao, China

Abbrevation

ASP-DAC

Link

http://www.amsv.umac.mo/aspdac2016/

City

Macao

Country

China

Deadline Paper

2015-07-08

Start Date

2016-01-25

End Date

2016-01-28

Abstract

Aims of the Conference: ASP–DAC 2016 is the 21th annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promote an instructive and productive interchange of ideas among EDA researchers/developers and system/circuit/device designers. All scientists, engineers, and students who are interested in theoretical and practical aspects of VLSI design and design automation are welcomed to ASP–DAC. Areas of Interest: Original papers in, but not limited to, the following areas are invited. [1] System–Level Modeling and Design Methodology: 1.1. HW/SW co–design, co–simulation and co–verification 1.2. System–level design exploration, synthesis and optimization 1.3. Model– and component–based embedded system/software design 1.4. System–level formal verification 1.5. System–level modeling, simulation and validation tools/methodology [2] Embedded System Architecture and Design: 2.1. Many– and multi–core SoC architecture 2.2. Reconfigurable and self–adaptive SoC architecture 2.3. IP/platform–based SoC design 2.4. Domain–specific architecture 2.5. Dependable architecture 2.6. On–chip memory architecture 2.7. Cyber physical system 2.8. Storage system architecture 2.9. Internet of things [3] On–chip Communication and Networks–on–Chip: 3.1. On–chip communication network 3.2. Networks–on–chip 3.3. Interface and I/O design 3.4. Optical and RF on–chip communication [4] Embedded Software: 4.1. Kernel, middleware and virtual machine 4.2. Compiler and toolchain 4.3. Real–time system 4.4. Resource allocation for heterogeneous computing platform 4.5. Storage software and application 4.6. Human–computer interface 4.7. System verification and analysis [5] Device/Circuit–Level Modeling, Simulation and Verification: 5.1. Device/circuit/interconnect modeling and analysis 5.2. Device/circuit–level simulation tool and methodology 5.3. RTL and gate–leveling modeling, simulation and verification 5.4. Circuit–level formal verification [6] Analog, RF and Mixed Signal: 6.1. Analog/mixed–signal/RF synthesis 6.2. Analog/mixed–signal/RF testing 6.3. Analog layout verification and simulation technique 6.4. Noise analysis 6.5. High–frequency electromagnetic simulation of circuit 6.6. Mixed–signal design consideration 6.7. Power–aware analog circuit/system design 6.8. Analog/mixed–signal modeling and simulation technique [7] System–Level Power and Thermal Management: 7.1. System–level low–power design and thermal management 7.2. System–level power modeling, analysis and simulation 7.3. Cross–layer reliability and aging 7.4. Architectural low–power design technique 7.5. Energy harvesting and battery management [8] Device/Circuit/Gate–Level Low Power Design: 8.1. Low–power design and methodology 8.2. Power modeling, analysis and simulation 8.3. Thermal aware design [9] Logic/Behavioral/High–Level Synthesis and Optimization: 9.1. High–level synthesis tool and methodology 9.2. Combinational, sequential and asynchronous logic synthesis 9.3. Logic synthesis and physical design technique for FPGA 9.4. Technology mapping [10] Physical Design: 10.1. Floorplanning, partitioning and placement 10.2. Interconnect planning and synthesis 10.3. Placement and routing optimization 10.4. Clock network synthesis 10.5. Post layout and post–silicon optimization 10.6. Package/PCB/3D–IC routing [11] Design for Manufacturability and Reliability: 11.1. Reticle enhancement, lithography–related design and optimization 11.2. Resilience under manufacturing variation 11.3. Design for manufacturability, yield, defect tolerance, cost issue, and DFM impact 11.4. Reliability, aging and soft error analysis 11.5. Design for reliability and robustness [12] Timing and Signal/Power Integrity: 12.1. Deterministic/statistical timing and performance analysis and optimization 12.2. Power/ground and package modeling, analysis and optimization 12.3. Signal/power integrity, EM modeling and analysis 12.4. Extraction, TSV and package modeling 12.5. 2D/3D on–chip power delivery network analysis and optimization [13] Test and Design for Testability: 13.1. ATPG, BIST and DFT 13.2. Fault modeling and simulation 13.3. System test and 3D IC test 13.4. Online test and fault tolerance 13.5. Memory test and repair 13.6. Analog and mixed–signal test [14] Security and Fault–Tolerant System: 14.1. Security modeling and analysis 14.2. Architecture, tool and methodology for secure hardware 14.3. Design for security and security primitive 14.4. Cross–layer security 14.5. Fault analysis, detect and tolerance [15] Emerging Technology: 15.1. New transistor/device and process technology: spintronic, phase–change, single–electron etc. 15.2. CAD for nanotechnology, MEMS, 3D IC, quantum computing etc. [16] Emerging Application: 16.1. Biomedical application 16.2. Big data application 16.3. Advanced multimedia application 16.4. Energy–storage/smart–grid/smart–building design and optimization 16.5. Datacenter optimization 16.6. Automotive system design and optimization 16.7. Electromobility