International Exhibition and Conference for System Integration in Micro Electronics, Nuremberg, Deutschland

Abbrevation

SMT Hybrid Packaging

Link

https://www.mesago.de/en/SMT/The_conference/Call_for_Tutorials/index.htm

City

Nuremberg

Country

Germany

Deadline Paper

2015-12-05

Start Date

2016-04-26

End Date

2016-04-28

Abstract

Interconnected factories, all–round communication, multifunctional systems: electronics manufacturing is facing great challenges in research, development and production. As in previous years, I would sincerely like to invite you to SMT Hybrid Packaging from 26 – 28 April 2016 in Nuremberg. Benefit from the latest technologies and take this opportunity to exchange information with representatives of other sectors. – What are the current requirements for electronic systems? – Which new materials and technologies are available? – How reliable can we produce and employ products? – Which trends are expected? Do you have answers to these questions? Then take a look at the Call for Tutorials for information about the current topic Areas: 1.Interconnection technology 1.1 Soldering 1.2 Adhesive bonding 1.3 DIE and wire bonding, flip chip 1.4 Application techniques 1.5 Sintering 1.6 Crimping 2.Testing technologies for electronic assemblies 3.Reliability, quality and traceability of printed circuit boards 4.Process optimization and competitiveness 5.New materials, materials development, material efficiency 6.Assembly of electronic components 7.Packaging and system integration 8.Power electronics and high temperature PCB 9.3–D integration technologies and System in Package (SiP) 10.Design, simulation and development tools 11.Printed electronics 12.Manufacturing logistics, equipment optimization and Overall Equipment Effectiveness (OEE) 13.Power LED systems and photonic boards 14.Environment, energy efficiency, disposal 15.Flex and rigid–flex PCB 16.Panel Level Packaging 17.Component standardization 18.Applications and technologies for Industry 4.0 in electronics 19.Process optimization via material flow logistics in SMD production 20.Molded (or Mechatronic) Interconnet Devices (3D–MID) 21.Generative production processes in electronics Main Focus A Production and practice B Research and future developments C Modelling and simulation