Applications of Interest<br>Advanced interconnects: Low–k interconnects, optical, wireless, and carbon–based interconnects, beyond Cu…<br>Contact on MOS devices: Silicide, III–V, 2D materials…<br>Memory architecture: CBRAM, PCRAM, OxRAM, MRAM, DRAM…<br>3D integration & wafer–level packaging: WtW/CtW bonding, Interposer, Through Si Via, CPI…<br>Novel System and Emerging Technology: Energy harvesting, brain–inspired computing…<br>Novel Form Factors: flexible electronics, wearables…<br>Topics of Interest<br>Process integration<br>Materials and Unit Processes (Dielectrics, Metals, barriers, Wet, CMP, PVD, CVD, SAM, patterning…)<br>Reliability and Failure analysis, techniques and methods<br>Advanced material or process characterization, Design–Technology co–optimization, and modelling techniques<br>Nano–materials<br>
Abbrevation
IITC/AMC
City
San Jose
Country
United States
Deadline Paper
Start Date
End Date
Abstract