COOL Chips is an International Symposium initiated in 1998 to present advancement of low–power and high–speed chips. The symposium covers leading–edge technologies in all areas of microprocessors and their applications. The COOL Chips XIX is to be held in Yokohama on April 20–22, 2016, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. All papers will be published online via IEEE Xplore. Authors of best papers will be recommended to submit an extended version to a COOL Chips special issue of IEEE Micro.<br>Contributions are solicited in the following areas:<br>Low Power–High Performance Processors for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.<br>Novel Architectures and Schemes for Single Core, Multi/Many–Core, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and Wireless.<br>Cool Software including Parallel Schedulers, Embedded Real–time Operating System, Binary Translations, Compiler Issues and Low Power Techniques.<br>
Abbrevation
COOL Chips
City
Yokohama
Country
Japan
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