City
Grenoble
Country
France
Start Date
End Date
Abstract
This year’s 4<sup>th</sup> edition of the European 3D Summit will celebrate a rich diversity of 3D Integration technologies. Going beyond Through–Silicon–Via (TSV) technology, SEMI will invite a set of high–profile conference speakers to talk about the full range of cutting–edge technologies being adopted in 3D Integration and miniaturized packaging.<br>