32nd European Mask and Lithography Conference, Dresden, Deutschland

Abbrevation

EMLC

Link

http://conference.vde.com/emlc2016/Pages/EMLC2016.aspx

City

Dresden

Country

Germany

Deadline Paper

2016-06-13

Start Date

2016-06-21

End Date

2016-06-22

Abstract

Conference Topics Presentations are solicited for the following and related topics: Mask Manufacturing – Mask Data Preparation – Pattern Generation: Writing, Etch, etc. – Photomask Processes & Materials – Metrology Tools & Technologies – Defect Inspection & Repair – Cleaning & Haze – Pellicles & Mask Boxes – Mask Process Yield & Cycle Time – Photomasks for RET & OPC; PSM – Masks for NGL: E–Beam, EUV, NIL, etc. Mask Business – Mask Business and Management – Mask Cost and Mask Development Strategy – Future Mask Demand Lithography and Mask Application – Double Patterning – DSA (Directed Self–Assembly) – RET, OPC, PSM, MEEF – Resist – Mask Defect Printability – Optical Materials – Immersion Lithography – Immersion Defectivity – Alternate Immersion Fluids – Lithography Process Control – Lithography Simulation Emerging Mask and Lithography Technologies – EUV Materials, Tools & Processes – EUV Mask Infastructure – NIL – Direct Write / ML2, Maskless Technologies Mask and Lithography Equipment – Mask Manufacturing