The topics include, but are not limited to, the following technical areas:<br>High–number Spec ICs: high speed/high frequency/high bandwidth/high integration/high performance circuits and systems.<br>Low–number Spec ICs: low power/low voltage/low noise/low complexity circuits and systems.<br>Device Technologies: CMOS, SOI, SiGe, GaAs, LDMOS, GaN, reliability, characterization, CAD, modeling, EM simulation, co–simulation, etc.<br>Packaging technology: MCM, SiP, TSV, MEMS, flip chip assembly, wire bonding, anisotropic conductive film, etc.<br>Passive Circuits and Antenna: on–chip antenna, integrated passive devices, ferrite, piezoelectric material, etc.<br>Frequency Generation ICs: VCOs, PLLs, synthesizers, ADPLL, frequency dividers, multipliers, etc.<br>Building Block RFICs: LNA, PA, mixers, RF front–end, Si–based MMIC, etc.<br>Analog and Mixed Signal ICs: amplifiers, ADC, DAC, comparators, filters, AGC/VGA, etc.<br>RF Sensor ICs: automotive radar, security, wearable devices, biomedical and healthcare applications, etc.<br>Power Transmission: RFIDs, electric coupling, electromagnetic induction, magnetic resonance, wireless power transmission, etc.<br>Emerging ICs: power management, digital RF circuits/architectures, RF BIST, data converters, reconfigurable and tunable ICs, new energy vehicle electronics EM and ICs, etc.<br>
Abbrevation
RFIT
City
Taipei
Country
Taiwan
Deadline Paper
Start Date
End Date
Abstract