European Microelectronics and Packaging Conference & Exhibition, Warsaw, Polen

Abbrevation

EMPC

Link

http://www.empc2017.pl

City

Warsaw

Country

Poland

Deadline Paper

2017-03-31

Start Date

2017-09-10

End Date

2017-09-13

Abstract

The 2017 European Microelectronics and Packaging Conference (EMPC) will be held for the first time in Poland, at Warsaw University of Technology on September 10 – 13, 2017. The conference will include a plenary session, parallel symposia and will be accompanied by thematic exhibition. ABSTRACTS ARE BEING REQUESTED IN THE FOLLOWING AREAS: – Advanced packaging and interconnects – Electronics components assembly and PCB solutions – Materials and processes – Printed, hybrid and flexible electronics – Modeling, design test & reliability – Functional systems (actuators, sensors, photovoltaics and related) All submitted abstracts must represent original, previously unpublished work. We look forward to welcome you to an inspiring and stimulating event.