The areas of interest include (but are not limited to) the following topics:<br>Analog Test<br>ATE Hardware and Software<br>Automatic Test Generation<br>Board Test and Diagnosis<br>Boundary Scan Test<br>Built–In Self–Test (BIST)<br>Current–Based Test<br>Defect–Based Test<br>Delay and Performance Test<br>Dependability and Functional Safety<br>Design for Test (DfT)<br>Design for Manufacturing (DfM)<br>Diagnosis and Silicon Debug<br>Economics of Test<br>Emerging Technologies<br>Failure Analysis<br>Fault Modeling and Simulation<br>Fault Tolerance<br>GPU Test<br>High–Speed I/O Test<br>Low–Power IC Test<br>Memory Test and Repair<br>MEMS Test<br>Microprocessor Test<br>Mixed–Signal Test<br>Multi–/Many–core Processor Test<br>Nanotechnology Test<br>On–line Test<br>Power Issues in Test<br>Reconfigurable System Test<br>Reliability<br>RF Test<br>Security and Trust Issues in Test<br>Self–Repair<br>Sensor Test<br>Signal Integrity Test<br>SiP, Stacked, 3D IC Test<br>SoC Test<br>Soft Errors<br>Standards in Test<br>Statistical Learning in Test<br>Test Compression<br>Test Quality<br>Test Synthesis<br>Thermal Issues in Test<br>Validation and Verification<br>Variability Issues in Test<br>Yield Analysis and Enhancement<br>
Abbrevation
ETS
City
Limassol
Country
Cyprus
Deadline Paper
Start Date
End Date
Abstract