The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. Detailed instructions for manuscript submission are available here. All contributions will be subjected to a rigorous review process, conducted by the TPC. Accepted papers will be included in the conference program as oral or poster presentations, depending on the results of the review process. All accepted papers will be published on IEEE Xplore.<br>TOPICS OF INTEREST<br>Modeling and simulation for SI/PI<br>Coupled Signal and Power Integrity analysis<br>Noise reduction and equalization techniques<br>High–speed link design and modeling<br>Power distribution networks<br>RF/microwave/mixed signal systems<br>3D IC and packages (TSV/SiP/SoC)<br>Nano–interconnects and nano–structures<br>Electromagnetic theory and modeling<br>Transmission line theory and modeling<br>Macromodeling and reduced order models<br>Electromagnetic compatibility<br>Design methodology/flow<br>Measurements<br>Jitter and noise modeling<br>Stochastic/sensitivity analysis<br>Electro–thermal modeling<br>Chip–package co–design<br>Novel CAD concepts<br>Optical interconnects<br>
Abbrevation
SPI
City
Brest
Country
France
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