Conference Topics<br>Process Level APC<br>Plasma etch, CVD and ALD<br>Chamber & process characterization (tool health, EEQA, finger printing, chamber matching), process models & model based sensors, dry clean, first wafer / wafer sequence effects effects, FDC (fault prediction), tool level APC, spare part assessment & qualification<br>Sputtering, P3I, and e––beam<br>Chamber & processes characterization (tool health, EEQA, finger printing, chamber matching), spare part assessment & qualification, tool level APC, arcing<br>Lithography<br>Exposure tools, coater & developer tracks, tool level APC, within wafer / within die close control<br>Thermal, wet processing & CMP<br>EEQA and finger printing, RTP<br>Backend<br>APC for testing, die bonding, wire bonding, plating, molding<br>Metrology and R2R<br>Virtual, inline, and offline metrology; soft sensors principles, large–area metrology<br>APC for legacy tools<br>Hardware & software modifications, integration into existing APC systems, sensor integration<br>Fab Level APC<br>Fab level process control methods<br>Run–to–run and wafer–to–wafer control, realtime control, control algorithms, defect inspection, test structures (wafer), sampling strategy<br>Virtual metrology<br>Application of process models, control density improvement, reduction of measurement operations and non–product wafers, throughput increase<br>Yield management<br>Prediction and improvement of product parameters and yield by use of APC methods, novel methods of yield modeling and management<br>Factory data analysis<br>Real–time data collection aggregation, classification and quality, process and equipment<br>capability, mathematical methods and model creation, novel methods of data visualization<br>and data analysis<br>IT infrastructure<br>Tool interfaces and communication, sensor / actuator bus, interfaces, demands on new standards<br>Manufacturing Effectiveness and Productivity<br>Unit process & equipment productivity<br>Throughput and uptime improvement, cycle time and variability reduction, non–productive wafer and substrate reduction, tool and unit process related productivity improvement<br>Factory productivity and automation<br>Factory scheduling and dispatching optimization, throughput and uptime improvement, cycle time and variability reduction, automation–related productivity improvement, master data management, tracking of materials, spare parts and consumables, production planning & control, wafer handling, maintenance strategy, lean manufacturing<br>Factory modeling, simulation and optimization<br>Design for manufacturing, future factory design, capacity and cost modeling, yield modeling & improvement, novel methods of manufacturing data analysis and visualization<br>Cost optimization and end–of–life equipment issues<br>Fixed and variable cost reduction, cost of ownership (CoO) and overall equipment efficiency (OEE), unit cost modelling, equipment and maintenance optimization<br>Environment and Green Manufacturing<br>Global ESH strategies, facilities operations, facility systems reliability improvements, manufacturing sustainability and resource conservation<br>
Abbrevation
apcm
City
Dresden
Country
Germany
Deadline Paper
Start Date
End Date
Abstract