IEEE Symposium on Low-Power and High-Speed Chips and Systems, Yokohama, Japan

Abbrevation

COOL Chips 21

Link

http://www.coolchips.org/

City

Yokohama

Country

Japan

Deadline Paper

2018-02-09

Start Date

2018-04-18

End Date

2018-04-20

Abstract

COOL Chips is an International Symposium initiated in 1998 to present advancement of low–power and high–speed chips and systems. The symposium covers leading–edge technologies in all areas of microprocessors and their applications. The COOL Chips 21 is to be held in Yokohama on April 18–20, 2018, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. All papers are published online via IEEE Xplore. Especially, selected academic papers are strongly invited to submit to the special issue on COOL Chips in the IEEE Transactions on Multi–Scale Computing Systems (TMSCS), and selected commercial papers are for publication in IEEE Micro. Contributions are solicited in the following areas: – Low Power–High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics. – Novel Architectures and Schemes for Single Core, Multi/Many–Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration. – Cool Software including Parallel Schedulers, Embedded Real–time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.