ESTC Conference<br>About ESTC Conference<br>Organized by IEEE–EPS (former CPMT) since 2006, the Electronics System–Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications.<br>ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global community of electronics packaging engineers and scientists.<br>ESTC is covering the following topics:<br>Advanced Packaging<br>Challenges and solutions in 3D integration, embedded structures, wafer level packaging, micro–bonding, TSVs, TEVs, advanced substrates and interposers<br>Materials for Interconnects and Packaging<br>New materials and processing – e.g. phase change, self–organizing, piezoelectric, dielectric and memory materials, nanomaterials, advanced interconnection metallurgies, adhesives in advanced interconnects<br>Optoelectronic Systems Packaging<br>Silicon photonics, Wafer Level Packaging and processes, Fiber optic and planar optical waveguides interconnections, optical sensors, LIDARs, OCTs, semiconductor tunable lasers packaging, O/E hybrid and heterogeneous integration at wafer level, LEDs and other solid state illumination device packaging<br>Assembly and Manufacturing Technologies<br>Novel assembly technologies, manufacturing aspects to novel packaging, wafer level processing<br>MEMS/NEMS and Sensors Packaging<br>Challenges and solutions in processing, integration and packaging, new packaging approaches, TSVs in MEMS, bonding technologies, wafer bonding, micro–bonding<br>Design Tools and Modeling<br>Thermal, mechanical and electrical modeling and experimental verifications, signal and power integrity<br>Power Electronic Systems Packaging<br>High performance packaging (low RDS(on), low Rth, high temperature), power embedding, very high voltage (>6.5kV) solutions, wide bandgap power semiconductor devices (e.g. SiC, GaN, GaAs), novel cooling solutions (e.g. double–sided cooling, bond–wire–less)<br>Locations of past ESTC:<br>Please find attached the call of papers and the call of exhibitors.<br>Advanced Technologies for Emerging Systems<br>Allotropes of carbon (CNTs, graphene, DLC, etc.), nanopackaging (nanoscaled materials, nanowires, nanointerconnects), emerging packaging concepts and technologies for bio–electronics, microfluidics, wearable electronics and sensors/actuators<br>Reliability of Electronic Devices and Systems<br>New results at different levels of system integration (chip contacts, packages, assemblies and subsystems), characterization and test, failure diagnostic, methodical and equipment developments, upcoming challenges due to new system integration demands, innovative materials and extended application fields<br>Flexible Printed and Hybrid Electronics<br>Printed/jetted (transparent) conductors, touch and large area sensors, signage and displays (e.g. LED, OLED, EL, electrochrome, electrophoretic), paper electronics, printed thin film PV and photodetectors, energy storage (batteries/supercapacitors) as well as flexible hybrid systems and processes integrating microelectronic components on flexible/stretchable substrates.<br>
Abbrevation
ESTC Conference
City
Dresden
Country
Germany
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