International Conference On Computer Aided Design, San Diego, Vereinigte Staaten

Abbrevation

ICCAD

Link

https://iccad.com/

City

San Diego

Country

United States

Deadline Paper

2018-04-27

Start Date

2018-11-05

End Date

2018-11-08

Abstract

Original technical submissions on, but not limited to, the following topics are invited: 1) SYSTEM–LEVEL CAD 1.1 System Design System–level specification, modeling, and simulation System design flows and methods HW/SW co–design, co–simulation, co–optimization, and co–exploration HW/SW platforms for rapid prototyping System design case studies and applications System–level issues for 3D integration Micro–architectural transformation Memory architecture and system synthesis System communication architecture Network–on–chip design methodologies and CAD Network–on–chip design case studies and prototyping 1.2 Hardware for Embedded Systems Multi–core/multi–processors systems HW/SW co–design for embedded systems Static and dynamic reconfigurable architectures Memory hierarchies and management System–level consideration of custom storage architectures (flash, phase change memory, STT–RAM, etc.) Application–specific instruction–set processors (ASIPs) Hardware and devices for neuromorphic and neural network computing Design method for learning on a chip New hardware techniques for approximate/stochastic computing 1.3 Embedded System Software Real–time software and operating systems Middleware and virtual machines Timing analysis and WCET Programming models for multi–core systems Profiling and compilation techniques Design exploration, synthesis, validation, verification, and optimization Embedded software development Embedded runtime support and resource management 1.4 System–level Security Hardware–based security (CAD for PUF’s, RNG, AES etc) Detection and prevention of hardware Trojans Side–channel attacks, fault attacks and countermeasures Split manufacturing for security System software security techniques Design for security CAD for security Security implications of CAD Cyberphysical system security Nanoelectronic security Counterfeiting Supply chain security 1.5 Dark Silicon and Power/Thermal Considerations in System Design Power and thermal estimation, analysis, optimization, and management techniques for hardware and software systems Energy– and thermal–aware application mapping and scheduling Energy– and thermal–aware dark silicon system design and optimization Energy– and thermal–aware architectures, algorithms and techniques Run–time management for the dark silicon 1.6 System Design Issues for Heterogeneous Computing Hardware–software partitioning of workloads Modeling and simulation of heterogeneous platforms High–level synthesis for heterogeneous computing Power/performance analysis of heterogeneous and cloud platforms Programming environment of heterogeneous computing Acceleration techniques including GPGPU and FPGA and dedicated ASIC’s Application driven heterogeneous platforms for big data, machine learning etc. Cloud Internet–of–Things (IoT) applications Interaction of Internet–of–Things (IoT) devices and the cloud Cloud computation for Internet–of–Things (IoT) devices Systems for neural computing (including deep neural networks) Applications and designs for systems based on optical devices 2) SYNTHESIS, VERIFICATION, & PHYSICAL DESIGN 2.1 High–level, Behavioral, and Logic Synthesis and Optimization: High–level/Behavioral/Logic synthesis Technology–independent optimization and technology mapping Functional and logic timing ECO Resource scheduling, allocation, and synthesis Interaction between logic synthesis and physical design 2.2 Testing, Validation, Simulation, and Verification High–level/Behavioral/Logic modeling and validation High–level/Behavioral/Logic simulation Formal, semi–formal, and assertion–based verification Equivalence and property checking Emulation and hardware simulation/acceleration Post–silicon functional validation Digital fault modeling and simulation Delay, current–based, low–power test ATPG, BIST, DFT, and compression Memory test and repair Core, board, system, and 3D IC test Post–silicon validation and debug Analog, mixed–signal, and RF test 2.3 Cell–Library Design, Partitioning, Floorplanning, Placement Cell–library design and optimization Transistor, gate, and wiring sizing High–level physical design and synthesis Estimation and hierarchy management 2D and 3D partitioning, floorplanning, and placement Post–placement optimization Buffer insertion and interconnect planning 2.4 Clock Network Synthesis, Routing, and Post–Layout Optimization and Verification 2D and 3D clock network synthesis 2D and 3D global and detailed routing Package–/Board–level routing and chip–package–board co–design Post–layout/–silicon optimization Layout and routing issues for optical interconnects 3) SOC ANALYSIS, SIMULATION, & TESTING 3.1 Design for Manufacturability Process technology characterization, extraction, and modeling CAD for design/manufacturing interfaces CAD for reticle enhancement and lithography–related design Variability analysis and statistical design and optimization Yield estimation and design for yield Physical verification and design rule checking 3.2 Design for Reliability Analysis and optimization for device–level reliability issues (stress, aging effects, ESD, etc.) Analysis for interconnect reliability issues (electromigration, thermal, etc) Reliability issues related to soft errors Design for resilience and robustness Reliability issues for optical devices 3.3 Timing, Power Networks, and Signal Integrity Deterministic and statistical static timing analysis and optimization Power and leakage analysis and optimization Circuit and interconnect–level low power design issues Power/ground network analysis and synthesis Signal integrity analysis and optimization 3.4 CAD for RF/Analog and Multi–Domain Modeling and Interconnect CAD for analog, mixed–signal, RF CAD for mixed–domain (semiconductor, nanoelectronic, MEMS, and electro–optical) devices, circuits, and systems CAD for nanophotonics and optical devices Analog, mixed–signal, and RF noise modeling and simulation Device, interconnect and circuit extraction and simulation Package modeling and analysis EM simulation and optimization Behavior modeling of devices and interconnect Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.) 4) CAD FOR EMERGING TECHNOLOGIES, PARADIGMS, & APPLICATIONS 4.1 Biological Systems and Electronics CAD for biological computing systems CAD for systems and synthetic biology CAD for bio–electronic devices, bio–sensors, MEMS, and systems 4.2 Nanoscale and Post–CMOS Systems New device structures and process technologies New memory technologies (flash, phase change memory, STT–RAM, memristor, etc.) Nanotechnologies, nanowires, nanotubes, graphene, etc. Quantum computing Optical devices and communication CAD for bio–inspired and neuromorphic systems 4.3 CAD for Cyber–Physical Systems CAD for Internet–of–Things (IoT) and sensor networks Design issues for Internet–of–Things (IoT) Devices Modeling and analysis of CPS CAD for automotive systems and power electronics Dependable and safe CPS design Analysis and optimization of data centers CAD for display electronics Green computing (smart grid, energy, solar panels, etc.)