DTIP′2019 will be the 20th anniversary edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique single–meeting event brings together participants interested in MEMS/MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS/MOEMS. All aspects including design, modeling, testing, micro–machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks. Papers presented at the conference will appear in IEEE Xplore and extended version of the presented papers may be submitted for inclusion in a special issue of an indexed journal.<br>We look forward to welcoming you in Paris next Spring.<br><div>Elie Lefeuvre, Jérôme Juilliard & Pascal Nouet</div><div><br></div><div> <b>Keywords:</b> Integrated processes (micromachining, micromolding, ...), Microlithography issues unique to MEMS/MOEMS, Manufacturing, Materials, Assembly technologies, Packaging for harsh environments, MOEMS packaging, RF and microwave packaging, Test structures, Devices & components (sensors, actuators...), Dimensional measurements, Physical measurements, Failure analysis, Reliability, Characterization, Process monitoring, </div> Technology CAD in general, Modeling and simulation of fabrication processes, Devices and components (sensors, actuators, ...), MEMS/MOEMS libraries and IP, Signal processing, Integrated CAD tools, Numerical simulation, Yield estimation, Failure mechanisms, Fault modeling, Fault simulation and test pattern generation, Thermal evaluation, Interoperability of CAD/CAE tools, Multidomain simulation, Structured design methodologies, Languages for interchange data among designs and tools
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DTIP
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Paris
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France
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