COOL Chips is an International Symposium initiated in 1998 to present<br>advancement of low–power and high–speed chips and systems.<br>The symposium covers leading–edge technologies in all areas of<br>microprocessors and their applications. The COOL Chips 22 is to be<br>held in Yokohama on April 17–19, 2019, and is targeted at the<br>architecture, design and implementation of chips with special emphasis<br>on the areas listed below. All papers are published online via IEEE<br>Xplore. Especially, selected academic papers are strongly invited to<br>submit to the special section in IEICE Transactions, and selected<br>commercial papers are for publication in IEEE Micro.<br>Contributions are solicited in the following areas:<br>– Low Power–High Performance Processors for AI, IoT, Multimedia,<br>Digital Consumer Electronics, Mobile, Graphics, Encryption,<br>Robotics, Automotive, Networking, Medical, Healthcare, and<br>Biometrics.<br>– Novel Architectures and Schemes for Single Core, Multi/Many–Core,<br>NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous,<br>Dependable Computing, GALS and 3D Integration.<br>– Cool Software including Parallel Schedulers, Embedded Real–time<br>Operating System, Binary Translations, Compiler Issues and Low<br>Power Application Techniques.<br>
Abbrevation
COOL Chips
City
Yokohama
Country
Japan
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