Abbrevation
AEC
City
Novi
Country
United States
Deadline Paper
Start Date
End Date
Abstract

The 2019 Automotive Electronics Reliability Workshop will be held at Sheraton Detroit Novi Hotel from April 30th to<br>May 2nd&#046; Previous workshops have been providing a forum and structured environment to discuss quality and<br>reliability problems and philosophies related to all aspects of passive component, discrete semiconductor, and<br>integrated circuit design, test, analysis, fabrication, assembly, and field performance&#046; The environment is a highly<br>interactive technical presentation and panel discussion format promoting open and frank communications within the<br>international automotive component supplier base&#046;<br>Some areas and topics that are relevant to and presented by workshop participants previously are listed below&#046;<br>Items in bold text are those of particular interest for this year’s workshop&#046; Works involved in Integrated Circuits,<br>Discrete and Passive Components are welcome&#046; Presentations and late breaking contributions relevant to today’s<br>activities and tomorrow’s ideas are also requested&#046;<br>Q100/Q101/Q200 Revisions &#8211; Impact<br>Field Quality Performance<br>Accelerated Stresses<br>Wafer Level Reliability<br>Product Characterization<br>Board Level Simulation<br>MCM Qualification/Screen<br>Reliability Simulation<br>Emerging Challenges<br>FMEA<br>Advanced Packaging<br>Technical Issues with 40nm and Below<br>Impact of OEM Automotive Environment<br>New Failure Analysis Methodologies<br>OEM/End&#8211;Customer Requirements<br>New Test/Screen Techniques<br>Quality System/Methodology Trends<br>Reliability Monitoring Usefulness<br>Burn&#8211;In/Test Screen Elimination<br>Application Specific Qualification<br>Criteria for Using Non&#8211;Automotive Parts<br>OEM System Reliability<br>Mission Profile Standardization<br>Extended Qualification Duration<br>EOS/ESD/NTF Reduction<br>Cu Wire Reliability<br>Best Practices<br>Field Performance<br>Emerging Technology<br>Autonomous Driving<br>Driver Assist/RF/Radar<br>MEM’s<br>LED’s<br>ISO Specification/ASIL<br>EMC/Latch&#8211;Up<br>Vehicle Communications/V2V<br>Internet&#8211;of&#8211;Things (IoT) in Vehicles<br>"Zero Defects" Implementation<br>New/Suspect Failure Mechanisms<br>Known Good Die (KGD)<br>Maverick Lot/Wafer Methodology<br>Design for Test/Analy<br>