Conference Topics<br>Presentations are solicited for the following and related topics:<br>Mask Manufacturing and Mask Business<br>Multi–Beam Writing of Leading–Edge Masks and NIL Master Templates<br>Mask Data Preparation<br>Pattern Generation: Writing, Etch, etc.<br>Photomask Processes & Materials<br>Metrology Tools & Technologies<br>Defect Inspection & Repair<br>Cleaning & Haze<br>Pellicles & Mask Boxes<br>Mask Process Yield & Cycle Time<br>Photomasks for RET (OPC, ILT) ; PSM<br>Mask Business and Management<br>Mask Cost and Mask Development Strategy<br>Future Mask Demand<br>Lithographic Systems and Processes<br>Optical Resolution Enhancements including OPC, Freeform Illumination, Source–Mask–optimization (SMO) and Inverse Lithography Technology (ILT)<br>Material–and Process driven Resolution Enhancements including Multiple Patterning and Chemical Shrinking<br>Immersion Lithography including Defectivity<br>Lithography Process Control<br><div>Lithography and Etch Simulation including rigorous physical/chemical Models and Compact Models</div><div><br></div> Emerging Mask and Lithography Technologies<br>EUV–Lithography including Masks, Materials Processes and Infrastructure.<br>Nano–Imprint Lithography (NIL)<br>Directed Self–Assembly (DSA) including High Chi Materials, Defectivity Control, and new Processes<br>Direct Write / Maskless Technologies<br>Emerging Applications<br>Non–IC Applications including Si–Photonics, Flat Panel Displays and MEMS<br>Lithographic Systems for non–IC Applications, including Laser Direct Write, Interference Lithography, and Mask Aligners<br>
Abbrevation
EMLC
City
Dresden
Country
Germany
Deadline Paper
Start Date
End Date
Abstract