Conference Overview<br>The IEEE A–SSCC 2019 (Asian Solid–State Circuits Conference) is an international forum for presenting the most updated and advanced chips and circuit designs in solid–state and semiconductor fields. The conference is supported by the IEEE Solid–State Circuits Society and will be held in Asia.<br>Conference Theme<br>Silicon System for Next Smart Society<br>Solid–state circuits have improved our lives for more than 50 years. There is no doubt that we have benefited from a wide variety of electronic equipment such as mobile computing devices, car electronics and digitalized social infrastructures.Rapid progress of artificial intelligence accelerated by deep learning, in conjunction with big data collected by IoT, may change our lives non–linearly. As a consequence, we will use smarter mobile devices, drive or be driven by, smarter cars and live on a smarter infrastructure, leading to totally different quality of life. There, we will face new challenges and opportunities for silicon systems, which our community should overcome and take advantage of.<br>Regular Session<br>1. Analog Circuits & Systems: Amplifiers, comparators, switched capacitor circuits, continuous–time & discrete–time filters, voltage/current references;DC–DC converters, power–control circuits; IF/baseband analog circuits, AGC/VGA; non–linear analog circuits.<br>2. Data Converters: Nyquist–rate and oversampling A/D, D/A converters, time–to–digital converters, and capacitance–to–digital converters; sub–circuits fordata converters including sample–and–hold circuits, calibration circuits, etc.<br>3. Digital Circuits & Systems: Design, fabrication, and test of digital VLSI systems; high–speed low–power digital circuits, power–reduction andmanagement methods for digital VLSI, ultra–low–voltage and sub–threshold logic design; leakage reduction techniques; clock distribution, I/O circuits,reconfigurable logic–array circuits; supply/substrate noise measurement and cancellation for digital VLSI, variation and fault–tolerant circuits.<br>4. SoC & Signal Processing Systems: System–on–chip(including 3D integration), microprocessors, network processors, baseband communicationprocessing system & architectures, system–level power management; multimedia and recognition processing systems; cryptographic, security, machinelearning,deep–learning, and neuromorphic circuits and systems; bio–medical/neural–network processors and sensor network systems.<br>5. RF: Receivers/transmitters/transceivers for wireless systems; narrowband RF, ultra–wideband and millimeter–wave circuits; circuits and building–blocksincluding RF front–end, LNA, mixer, power amplifiers, VCOs, frequency synthesizers, RF filters, RF switches, power detectors, active antennas.<br>6. Wireline: Receivers/transmitters/transceivers for wireline systems; optical/electrical data links and backplane transceivers; power–line communication;clock generation circuits, PLL, DLL, spread–spectrum clock generation; building blocks for high–speed wireline communication; analog–digital mixedmodecircuits.<br>7. Emerging Technologies and Applications: Advanced system designs and circuit solutions for technologies and applications including state–of–the–artdevices and packaging technologies; flexible and printable electronics;silicon photonices;smart sensors and transducers; MEMS for analog, RF, and sensor applications;image sensors and displays; energy harvesting systems; transceiver systems; medical/bio–electronics/bio–inspired chip design,artificial intelligent system,and cryogenic circuits and systems.<br>8. Memory: Volatile and Non–volatile memory; new memory designs for 3D/2D architectures, emerging devices such as resistive–/phase change–/magnetic–/ferro–electric– memory devices; data storage and multi–bit–cell memory design; cache–memory system, multi–port memory, memory subsystem,processing in memory, and CAM design; yield–enhancing and ECC techniques; memory testing and built–in self–test.<br>9. FPGA: Novel algorithm and/or architecture for integrated circuits validated by FPGA implementation. The authors of accepted papers are required to participate in demo sessions.<br>Special Session<br>1. Industry Program: This special category accepts only papers based on state–of–the–art industrial products. Strong emphasis on systems realized bysilicon chips is encouraged. The papers should cover architecture, circuits, process technology, packaging and testing, includin g characterization results,die and system photos, as well as product demos.<br>2. Student Design Contest: A student design contest is held among the accepted papers with system prototypes or measurement results of whichoperations can be demonstrated on–site. Refer to the web for further information.<br>
Abbrevation
ASSCC
City
Macao
Country
China
Deadline Paper
Start Date
End Date
Abstract