★TOPICS<br>Digital, Analog, Mixed Signal IC and SOC design technology<br>Silicon integrated circuits and manufacturing<br>Low–power, RF devices & circuits<br>IC Computer–Aided –Design technology, DFM<br>Silicon/germanium devices and device physics<br>Interconnect, Low K, High K and other process technologies<br>Unconventional and nano–electronics<br>Organic semiconductor devices and technologies<br>Compound semiconductor devices and circuits<br>Displays, sensors and MEMS<br>Semiconductor materials and material characterization<br>Packaging and testing technology<br>Solar cell & other devices for new energy sources<br>Modeling and simulation<br>Equipment technology<br>Reliability<br>Displays, sensors and MEMS<br>Advance memories technology (Flash, FeRAM, PCM，ReRAM, MRAM etc.)<br>
Abbrevation
ICICM
City
Beijing
Country
China
Deadline Paper
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