IEEE Symposium on Low-Power and High-Speed Chips and Systems, Hitachi Central Research Laboratory, Japan

COOL Chips is an International Symposium initiated in 1998 to present advancement of low–power and high–speed chips and systems. The symposium covers leading–edge technologies in all areas of microprocessors and their applications. The COOL Chips 23 is to be held in Tokyo on April 15–17, 2020. Contributions are solicited in the following areas: Low Power–High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics. Novel Architectures and Schemes for Single Core, Multi/Many–Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration. Cool Software including Parallel Schedulers, Embedded Real–time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.